NanoResearchINC.

Advanced materials

OrbitalGuard™

Protection, engineered into the interface.

Thin material architectures for electromagnetic shielding and multifunctional interfaces, developed around the requirements of a specific component or assembly.

01 / RESEARCH DIRECTION

Understand
the approach.

OrbitalGuard combines conductive and nanocomposite layers. Layer selection, electrical contact and integration into the host assembly are part of the engineering problem. OG-19 and PI63 are distinct configurations and must be evaluated separately.

02 / CONFIGURATIONS

Explore the
design pathways.

Choose a configuration to examine its engineering focus.

OG-19

A thin copper and nanocomposite configuration for interface investigations.

Nominal stack thickness
19 µm
Copper layer
9 µm
Fe₂O₃ and CNT nanocomposite layer
10 µm
Integration focus
Defined contact, bonding and assembly geometry

03 / APPLICATION PATHWAYS

Start with
your application.

Select a pathway to see the integration and evaluation considerations.

Telecom radio assemblies

The challenge

Limited space for shielding interfaces in radio electronics and enclosure assemblies.

Integration focus

Investigate a defined internal partition, conductive liner or enclosure interface. Establish the grounding arrangement and the exact incumbent component to compare.

Evaluation direction

Use the assembly’s frequency-dependent EMC requirements and compare the complete installed configuration, including seams, contacts and durability.

Discuss this application ↗

04 / EVIDENCE & EVALUATION

Define what
success looks like.

The dimensions above are nominal company configuration references, not a released customer specification. Shielding effectiveness depends on frequency, specimen configuration and assembly integration. Request the evidence applicable to your intended configuration.

Prepare for a technical discussion

Bring the operating context and constraints. We can then identify a relevant development or evaluation pathway.

  • Target frequency range and assembly EMC requirements
  • Available thickness and intended attachment method
  • Grounding, electrical isolation and corrosion constraints
  • Incumbent configuration and comparison criteria
Prepare an inquiry ↗

Submit an inquiry and receive a reference once it is stored.